Open tenders for Optim Wafer Services
127 open tenders fit what Optim Wafer Services offers; 7 are in the categories where it won public tenders since 2024.
- Research and experimental development services · 1 win
Tenders that fit what Optim Wafer Services offers
Closest in meaning to its products: Contract wafer processing (grinding, thinning, dicing, polishing), wafer reclaim and test wafer supply for the semiconductor industry · Wafer reclaim, thinning, dicing and processing services for semiconductor manufacturers from Gréasque, France. Tenders in other languages match too. Best fit first, top 20 of 127.
Delivery and installation of a ICP Reactive ion etcher for silicon dielctrics
Fits: Contract wafer processing (grinding, thinning, dicing, polishing), wafer reclaim and test wafer supply for the semiconductor industry
Prestations de criblage, concassage, valorisation et évacuation des matériaux inertes issus de la plateforme de recyclage de la Gravaire sur l'île d'Yeu
Fits: Wafer reclaim, thinning, dicing and processing services for semiconductor manufacturers from Gréasque, France
Supply, Delivery, Installation, Commissioning, Calibration and Validation of an Electroplating and Wet Processing System, for Tyndall National Institute, University College Cork (UCC)
Fits: Contract wafer processing (grinding, thinning, dicing, polishing), wafer reclaim and test wafer supply for the semiconductor industry
Traitement des cartons, Transport et traitement des DMS, Broyage et criblage des déchets verts
Fits: Wafer reclaim, thinning, dicing and processing services for semiconductor manufacturers from Gréasque, France
Fourniture, livraison, installation, mise en ordre de marche d’un équipement pour la micro découpe automatisée de composants ainsi que les prestations associées.
Fits: Contract wafer processing (grinding, thinning, dicing, polishing), wafer reclaim and test wafer supply for the semiconductor industry
Deep Reaction Ion Etcher (DRIE)
Fits: Wafer reclaim, thinning, dicing and processing services for semiconductor manufacturers from Gréasque, France
Backend BCB curing vacuum Oven
Fits: Contract wafer processing (grinding, thinning, dicing, polishing), wafer reclaim and test wafer supply for the semiconductor industry
Milling of garden waste and sieve compost.
Fits: Contract wafer processing (grinding, thinning, dicing, polishing), wafer reclaim and test wafer supply for the semiconductor industry
Przetwarzanie odpadów komunalnych pochodzących z terenu Gminy Grójec
Fits: Wafer reclaim, thinning, dicing and processing services for semiconductor manufacturers from Gréasque, France
Container management, transport and treatment of porcelain and ceramics.
Fits: Contract wafer processing (grinding, thinning, dicing, polishing), wafer reclaim and test wafer supply for the semiconductor industry
Framework agreement for supply of chip pre-laminated sheets // Rámcová smlouva na dodávky čipových předlaminátů
Fits: Contract wafer processing (grinding, thinning, dicing, polishing), wafer reclaim and test wafer supply for the semiconductor industry
Procedura aperta ex artt. art 59 e art. 71 del codice dei contratti (D.lgs. 36/2023) per la sottoscrizione di un Accordo Quadro della durata di due anni con unico operatore economico, per l’affidamento del servizio di smaltimento e demilitarizzazione di munizioni e manufatti esplosivi di classe I per le esigenze di Agenzia Industrie Difesa.
Fits: Contract wafer processing (grinding, thinning, dicing, polishing), wafer reclaim and test wafer supply for the semiconductor industry
Competition for the procurement of a supplier for testing subject tests
Fits: Contract wafer processing (grinding, thinning, dicing, polishing), wafer reclaim and test wafer supply for the semiconductor industry
Tkáňový procesor
Fits: Contract wafer processing (grinding, thinning, dicing, polishing), wafer reclaim and test wafer supply for the semiconductor industry
Procedura aperta ai sensi del d.lgs. n. 36/2023 e s.m.i. per l'affidamento di un accordo quadro per la fornitura di inlay per la produzione della carta d'identità elettronica
Fits: Contract wafer processing (grinding, thinning, dicing, polishing), wafer reclaim and test wafer supply for the semiconductor industry
MISE A DISPOSITION DE CONTENANTS/CAISSONS, ENLEVEMENT, TRANSPORT, RECEPTION, TRI, TRAITEMENT, VALORISATION ET ELIMINATION DES DECHETS EN 2 LOTS SUR 3 ANS
Fits: Wafer reclaim, thinning, dicing and processing services for semiconductor manufacturers from Gréasque, France
Recyclage, valorisation et traitement des déchets collectés en déchèterie
Fits: Wafer reclaim, thinning, dicing and processing services for semiconductor manufacturers from Gréasque, France
Prestación de Servicios Agrarios
Fits: Contract wafer processing (grinding, thinning, dicing, polishing), wafer reclaim and test wafer supply for the semiconductor industry
SUMINISTRO DE MATERIAL ELÉCTRICO, ELECTRÓNICO, DE TELECOMUNICACIONES Y RECAMBIOS DE MARCAS INSTALADAS
Fits: Contract wafer processing (grinding, thinning, dicing, polishing), wafer reclaim and test wafer supply for the semiconductor industry
Procurement of accounting services with an option for payroll services.
Fits: Contract wafer processing (grinding, thinning, dicing, polishing), wafer reclaim and test wafer supply for the semiconductor industry
In the categories Optim Wafer Services wins
Realizzazione di un prototipo di installazioni sperimentali per il Laboratorio di Ingegneria Costiera (LIC) del Politecnico di Bari
Procedura telematica aperta ex art. 71 del D. lgs. n. 36/2023 finalizzata allacquisizione di un servizio di sviluppo e produzione vettore AAV a supporto di studio tossicologia nell'ambito del progetto di ricerca Sviluppo di un approccio di terapia genica per la cura delle Distrofie retiniche ereditarie legate a mutazioni nel gene CRX finanziato dalla Regione Campania
PR1260373 - Entwicklung einer Web-Plattform für den Betrieb produktnaher Audioanwendungen
Fortführung des Monitorings zur Umsetzung der Pflegeausbildungen gemäß § 60 Abs. 6 PflAPrV bis 2031
Non-Clinical Toxicology and safety assessment of a small molecule
Pre-CommerciAl ProCuremenT of Innovative Personal ProtectiVe Equipment for First REsponders (ACTIVE PCP)
Assistance mechanism on Maritime Spatial Planning (MSP)