Optim Wafer Services

Wafer reclaim, thinning, dicing and processing services for semiconductor manufacturers from Gréasque, France

Greasque, FranceFounded 2007optimwaferservices.com Website technologies

Highlights

New on EvolcAdded 2026-10-29

About Optim Wafer Services

Optim Wafer Services provides wafer surface processing, cleaning and handling of substrates. Its services include wafer grinding and thinning, dicing, edge trimming, wafer reclaim and supply, SOI wafer processing, MPW dicing and thinning, and process development.

Its business has two main parts: test wafer reclaim and test wafer supply, where new or reclaimed wafers are repolished for use as test wafers, and wafer processing and process development for customers who need custom process steps or products. The company describes its customers as semiconductor manufacturers and works on bespoke process steps for their requirements.

The company was founded in 2007, is headquartered in Gréasque, France, and is located in the Rousset region in the south of France. A 300mm reclaim recycling line (FREXiN300) is partly funded by the French government under the "Plan de Relance" recovery plan, and the company reports completing stage 1 of automating its 200mm polishing line.

Product: Contract wafer processing (grinding, thinning, dicing, polishing), wafer reclaim and test wafer supply for the semiconductor industry.

Public tenders won

1 tender won since 1 Jan 2024 from 1 public buyer in France. From EU award notices (TED) that name Optim Wafer Services by its registry number.

5 Oct 2026 Commissariat à l'énergie atomique et aux énergies alternatives · Prestations de recyclage de plaques de silicium 200mm et fourniture de plaques de silicium recyclées 200mm notice

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Jobs at Optim Wafer Services

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