Open tenders for Instria
17 open tenders fit what Instria offers.
Tenders that fit what Instria offers
Closest in meaning to its products: Printed ultra-thin sensors and electrical components applied directly onto machine components via a proprietary hybrid laser-printing process · Printed ultra-thin sensors on machine components for industrial and aerospace customers. Tenders in other languages match too. Best fit first.
Adquisición y puesta en funcionamiento de una microfresadora láser de alta precisión para la fabricación de prototipos de circuitos impresos en distintos materiales. Expediente SU13826004479.
Fits: Printed ultra-thin sensors and electrical components applied directly onto machine components via a proprietary hybrid laser-printing process
Ultra-high Resolution Electron-beam Lithography System
Fits: Printed ultra-thin sensors and electrical components applied directly onto machine components via a proprietary hybrid laser-printing process
3D-printer for metal of the type Metal Wire Laser Direct Energy Deposition
Fits: Printed ultra-thin sensors and electrical components applied directly onto machine components via a proprietary hybrid laser-printing process
Integrated system for electric characterization and probing of semiconductor components and neuromorphic electronics
Fits: Printed ultra-thin sensors and electrical components applied directly onto machine components via a proprietary hybrid laser-printing process
Echipament pentru microfabricare de tip maskless aditiva - "screen printing"
Fits: Printed ultra-thin sensors and electrical components applied directly onto machine components via a proprietary hybrid laser-printing process
Acquisition, livraison, installation et mise en service d’une machine de micro-usinage laser
Fits: Printed ultra-thin sensors and electrical components applied directly onto machine components via a proprietary hybrid laser-printing process
Suministro de sistema de grabado mediante haz iónico (Ion beam Etching - IBE)
Fits: Printed ultra-thin sensors and electrical components applied directly onto machine components via a proprietary hybrid laser-printing process
Lieferung einer Ultrakurzpuls-Laseranlage für hochschulübergreifende interdisziplinäre Forschung zur Sensorik, Aktorik, Medizintechik und KI-basierter Bearbeitung
Fits: Printed ultra-thin sensors and electrical components applied directly onto machine components via a proprietary hybrid laser-printing process
Un équipement plasma de gravure ionique réactive de métaux pour le Centre de MicroNanoTechnologie
Fits: Printed ultra-thin sensors and electrical components applied directly onto machine components via a proprietary hybrid laser-printing process
Un système de pulvérisation cathodique dédié à la déposition de couches minces supraconductrices de haute qualité
Fits: Printed ultra-thin sensors and electrical components applied directly onto machine components via a proprietary hybrid laser-printing process
Imprimanta 3D
Fits: Printed ultra-thin sensors and electrical components applied directly onto machine components via a proprietary hybrid laser-printing process
Delivery and installation of a ICP Reactive ion etcher for silicon dielctrics
Fits: Printed ultra-thin sensors on machine components for industrial and aerospace customers
Electron Beam Lithography (EBL) Tool
Fits: Printed ultra-thin sensors and electrical components applied directly onto machine components via a proprietary hybrid laser-printing process
Fourniture, livraison, installation, mise en ordre de marche d’un équipement pour la micro découpe automatisée de composants ainsi que les prestations associées.
Fits: Printed ultra-thin sensors and electrical components applied directly onto machine components via a proprietary hybrid laser-printing process
Präzises PBF-LB/M System
Fits: Printed ultra-thin sensors and electrical components applied directly onto machine components via a proprietary hybrid laser-printing process
Suministro de sistema de litografía por escritura directa mediante láser (Direct Laser Writing, DLW)
Fits: Printed ultra-thin sensors and electrical components applied directly onto machine components via a proprietary hybrid laser-printing process
STANDARDAND TECHNICALSPECIFICATIONSTO GOVERN THE CONTRACT FOR THESUPPLYAND INSTALLATIONOF EQUIPMENT AND COMPONENTS WITHIN DIREQT-DIAMOND FOR INDUSTRY READY QUANTUM TECHNOLOGIES PROJECT
Fits: Printed ultra-thin sensors and electrical components applied directly onto machine components via a proprietary hybrid laser-printing process