Open tenders for Argotech
386 open tenders fit what Argotech offers; 5 come from public bodies that already sign contracts with Argotech.
Tenders that fit what Argotech offers
Closest in meaning to its products: Contract back-end assembly, packaging, R&D and testing services for semiconductor photonics and microelectronics components · Back-end assembly, packaging and testing services for semiconductor photonics chips for OEM and R&D customers. Tenders in other languages match too. Best fit first, top 20 of 386.
Rahmenvertrag Konstruktion und Fertigung von Hardware (insbesondere Brennkammern) für atmosphärische und bedruckte Gasturbinenprüfstände
Fits: Contract back-end assembly, packaging, R&D and testing services for semiconductor photonics and microelectronics components
SERVICIO DE SOPORTE TÉCNICO PARA EL MANTENIMIENTO DE LA INFRAESTRUCTURA HEWLETT PACKARD ENTERPRISE
Fits: Contract back-end assembly, packaging, R&D and testing services for semiconductor photonics and microelectronics components
Backend BCB curing vacuum Oven
Fits: Contract back-end assembly, packaging, R&D and testing services for semiconductor photonics and microelectronics components
Služby kombinované laboratoře měření elektromagnetických emisí, odolnosti a testování finálního produktu a prototypů ve specifickém prostředí
Fits: Contract back-end assembly, packaging, R&D and testing services for semiconductor photonics and microelectronics components
Suministro, instalación y puesta en funcionamiento de un sistema de microscopía electrónica y litografía por haz de electrones para microfabricación y fotónica integrada
Fits: Contract back-end assembly, packaging, R&D and testing services for semiconductor photonics and microelectronics components
Raamovereenkomst aankoop en ondersteuning netwerk- en beveiligingscomponenten en aanverwante diensten
Fits: Contract back-end assembly, packaging, R&D and testing services for semiconductor photonics and microelectronics components
IT Dienstleistung 1
Fits: Contract back-end assembly, packaging, R&D and testing services for semiconductor photonics and microelectronics components
Contratación del servicio de integración y configuración de una herramienta para optimización de rutas de reparto y mantenimiento técnico.
Fits: Contract back-end assembly, packaging, R&D and testing services for semiconductor photonics and microelectronics components
Contractació del servei d'Assessorament i Gestió professional en matèria de Propietat Industrial i Intel·lectual de la Fundació Bosch i Gimpera
Fits: Contract back-end assembly, packaging, R&D and testing services for semiconductor photonics and microelectronics components
SUMINISTRO DE UN EQUIPO AVANZADO DE ENSAMBLAJE E INTEGRACIÓN DE CIRCUITOS MICROELECTRÓNICOS DEL INSTITUT DE FÍSICA D’ALTES ENERGIES (IFAE). EXP: IFAE-2026/20
Fits: Contract back-end assembly, packaging, R&D and testing services for semiconductor photonics and microelectronics components
Contract 2445 Assembly and commissioning of locks and fittings - base - New Aker
Fits: Contract back-end assembly, packaging, R&D and testing services for semiconductor photonics and microelectronics components
Suministro, instalación y puesta en funcionamiento de un analizador de redes ópticas
Fits: Contract back-end assembly, packaging, R&D and testing services for semiconductor photonics and microelectronics components
Supply, Delivery, Installation, Commissioning, Calibration and Validation of an Electroplating and Wet Processing System, for Tyndall National Institute, University College Cork (UCC)
Fits: Contract back-end assembly, packaging, R&D and testing services for semiconductor photonics and microelectronics components
Submission Mobile Endgeräte
Fits: Contract back-end assembly, packaging, R&D and testing services for semiconductor photonics and microelectronics components
Fourniture, collecte et analyses des bracelets en silicone auprès des cohortes E3N-Générations, Constances et Elfe/Epipage2
Fits: Contract back-end assembly, packaging, R&D and testing services for semiconductor photonics and microelectronics components
STANDARDAND TECHNICALSPECIFICATIONSTO GOVERN THE CONTRACT FOR THESUPPLYAND INSTALLATIONOF EQUIPMENT AND COMPONENTS WITHIN DIREQT-DIAMOND FOR INDUSTRY READY QUANTUM TECHNOLOGIES PROJECT
Fits: Contract back-end assembly, packaging, R&D and testing services for semiconductor photonics and microelectronics components
Applicant Tracking Software
Fits: Contract back-end assembly, packaging, R&D and testing services for semiconductor photonics and microelectronics components
Fourniture de toutes pièces et accessoires de signalisation lumineuse réglementée ainsi que les pièces et équipements pour l'image équipant les véhicules légers, utilitaires légers, poids-lourds et engins de l'Eurométropole de Strasbourg
Fits: Contract back-end assembly, packaging, R&D and testing services for semiconductor photonics and microelectronics components
Réalisation de contrôles de conformité de produits, en laboratoire, dans le cadre de la surveillance du marché et de la vérification de la libre circulation des produits au sein du marché intérieur européen_ Sécurité des alimentations électriques
Fits: Contract back-end assembly, packaging, R&D and testing services for semiconductor photonics and microelectronics components
Electrical and calibration services
Fits: Contract back-end assembly, packaging, R&D and testing services for semiconductor photonics and microelectronics components
Your public customers are buying
Open tenders from buyers that signed contracts with Argotech in the last two years (Slovak and Czech contract registers). Everything they tender, not only what Argotech sells.