LIDROTEC

LIDROTEC develops the LidroCUT laser dicing system, which cuts microchips and devices (wafer dicing) using a laser combined with controlled fluids for cooling and particle removal. The company presents the machine for semiconductor production and also mentions energy, medicine, electronics and material science as target industries. It also offers feasibility studies and contract manufacturing for wafer dicing in liquids.

The website describes the customers as semiconductor manufacturers and other industrial users of wafer processing; no revenue model beyond machine sales, service and contract manufacturing is stated. The company describes itself as Made in Germany and lists four co-founders (CEO, CDO, CTO, CPO) on its About Us page.

The registered office is Lidrotec GmbH, Lothringer Allee 2, 44805 Bochum, Germany. The careers page lists 15 open positions, all in Bochum, across business functions (finance, accounting, supply chain) and technical roles (field service, product support, production, project management, customer support).

Product: LidroCUT laser dicing machine for wafer dicing in liquids, with feasibility studies and contract manufacturing offered