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Kandou AI

Copper-based chip interconnect technology for GPU, memory and networking links in AI data centres

Switzerlandkandou.aiWebsite technologies

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Highlights

  • Hiring43 open roles
  • New on EvolcAdded 2026-10-23
  • Remote-friendly28 of 43 open roles remote or hybrid

About Kandou AI

Kandou AI develops Copper MIMO (Chord Signaling) interconnect technology, which treats crosstalk and noise on copper channels as signal energy to carry data over copper with higher bandwidth, longer reach and lower power. Its planned product areas are GPU scale-up and scale-out connectivity, memory connectivity, network connectivity and rack connectivity using field repairable near-package optics.

The company's silicon includes chiplets and USB4 and PCIe retimers, and its technology has design wins with a global networking infrastructure provider and with AMD. It reports PVT testing with large hyperscaler customers and more than 27 million units shipped. It describes its customers as leading AI infrastructure builders.

Kandou AI was founded in 2011 out of EPFL and is headquartered in Switzerland, with the Saint-Sulpice site listed as HQ. It also lists work locations in Hyderabad, Bangalore, Pune, Reading, Cambridge, Northampton, Taipei and Dortmund. Current openings cover analog, digital and physical design, firmware, FPGA, design verification, DFT, characterization and lab roles.

Product: Copper MIMO (Chord Signaling) chip-to-chip interconnect technology and silicon, including chiplets and retimers, for AI infrastructure links.

Jobs at Kandou AI (43)

Kandou AI is hiring for 43 roles, mostly in engineering, based in Hyderabad and Saint-Sulpice. One is remote.

See all 43 jobs at Kandou AI →

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